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Substrate Wetting

Effective substrate wetting promotes rapid and uniform spreading of the formulation. Surface tension differences are balanced to avoid defects such as crawling or pinholing. The result is complete coverage and improved adhesion.

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Bottle representation of TEGO® Wet 270

TEGO® Wet 270

TEGO® Wet 270 shows excellent anti-crater properties with flow promotion in waterborne, solventborne, and radiation-curing coatings.

company logo of Evonik
Technologies
Radiation curing systems
Solventborne
Waterborne
Bottle representation of TEGO® Wet 270 eCO

TEGO® Wet 270 eCO

NEW

TEGO® Wet 270 eCO is a highly active and broadly usable substrate wetting agent based on polyether siloxane technology. Applies mass balance approach to replace fossil by circular raw materials. Same well known performance as TEGO® Wet 270 but reduced carbon emissions.

company logo of Evonik
Technologies
Radiation curing systems
Solventborne
Waterborne
Bottle representation of TEGO® Rad 2100

TEGO® Rad 2100

TEGO® Rad 2100 is a compatible radically cross-linkable substrate wetting and flow additive with little influence on COF and reprintability. Recommended for radiation-curing varnishes and inks.

company logo of Evonik
Technologies
High solids (solventborne)
Radiation curing systems
Solventfree
Bottle representation of TEGO® Rad 2300

TEGO® Rad 2300

TEGO® Rad 2300 is an efficient non-foaming, radically cross-linkable substrate wetting and slip additive. Recommended even for high shear applications and the wetting of low energy substrates incl. fresh litho inks.

company logo of Evonik
Technologies
High solids (solventborne)
Radiation curing systems
Solventfree
Bottle representation of TEGO® Twin 4000

TEGO® Twin 4000

TEGO® Twin 4000 is a siloxane-based gemini surfactant. It combines substrate wetting with good defoaming. It is very effective and suitable for a broad range of coatings.

company logo of Evonik
Technologies
High solids (solventborne)
Radiation curing systems
Solventborne
Waterborne

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